PCBINQ offers free PCB DFM file inspection to help you shorten project cycle time and increase product development success rate.
What is DFM?
DFM stands for Design for Manufacturability.
The goal is to make products easier to manufacture, cheaper, of higher quality, and faster to market.
Methods include: considering manufacturing constraints early on, reducing parts and tolerances, standardizing components, facilitating assembly, and collaborating with manufacturing engineering.
Quick Start
Verify your PCB design in just 4 simple steps:
- Generate and export the Gerber data package.
- Upload the compressed file to our inspection tool.
- Provide your email address to receive the report.
You will receive an email with a link to instantly view/download a PDF version of your design, download a detailed DFM analysis report, and confidently submit your inquiry.
Example diagram
Quality Assurance
The 8 DFM Checks We Run
01
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Clearance & Spacing
Auto
Trace · Pad · Copper-to-edge
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Trace-to-Trace ClearanceSpacing between copper traces verified against board class minimums (standard: 3/3 mil).
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Copper-to-Board EdgeAll copper must sit ≥0.2 mm from the routed edge to prevent exposure or shorting.
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Pad-to-Pad SpacingAdjacent pads checked for bridging risk, especially on fine-pitch SMD components.
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Plane-to-Hole ClearancePower and ground plane clearance around all through-holes and vias verified.
02
+
Drill Hole Verification
Auto
Hole size · Annular ring · Aspect ratio
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Minimum Hole DiameterMechanical drill floor is 0.2 mm. Smaller holes are flagged for laser drill or redesign.
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Annular Ring WidthCopper ring around each hole must be ≥0.1 mm to survive drilling tolerances reliably.
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Hole-to-Hole SpacingMinimum 0.5 mm between hole edges to prevent breakout and structural weakness.
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Blind/Buried Via Aspect RatioDepth-to-diameter ratio must be ≤1:1 for reliable copper plating through the barrel.
03
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Solder Mask Integrity
Auto
Opening accuracy · Bridge width · Coverage
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Opening Coverage Per PadEvery exposed pad must have a correctly sized opening — too small causes poor adhesion; too large risks shorting.
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Bridge Width Between PadsMask web between adjacent pads must be ≥0.1 mm. Narrower bridges collapse during lamination.
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Missing or Accidental OpeningsScan for pads with no opening and non-pad copper with unintended exposed areas.
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Via Tenting ConfirmationTented vs. open vias verified against design intent to prevent solder wicking into unwanted holes.
04
+
Silkscreen Layer
Auto
Legibility · Pad overlap · Character size
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Ink Over Solder PadsSilkscreen on bare pads is removed — ink causes solder defects and component misalignment.
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Minimum Character SizeText height ≥0.8 mm, line width ≥0.15 mm required for legible print. Sub-threshold text is flagged.
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Overlap With Drill HolesGraphics over drilled holes will be destroyed during production. All overlaps flagged for repositioning.
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Reference Designator ClarityDesignators verified for visibility, correct orientation, and clear separation from other elements.
05
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Copper & Trace Quality
Auto
Width · Acute angles · Dead copper · Thermal relief
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Trace Width vs. Current LoadChecked against IPC-2221 guidelines for your board class and copper weight.
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Acute Angle Traces (<45°)Sharp corners trap acid during etching. All 90° corners and sub-45° angles flagged.
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Isolated Dead CopperFloating copper islands trap etchant and cause shorts. Every unconnected area is identified.
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Thermal Relief on Through-Hole PadsSolid connections to pours cause cold solder joints. Thermal spoke design is verified.
06
+
Board Stackup & Material
Engineer
Layer count · Impedance · Warpage · Material
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Layer Count vs. ThicknessConfirmed that your selected layers and board thickness match a standard manufacturable stackup.
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Controlled Impedance50Ω and differential pair requirements verified against stackup and trace width specified.
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Symmetric Stackup for WarpageCopper distribution reviewed for symmetry — asymmetry causes bow that fails IPC-A-600.
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Material SuitabilityHigh-frequency designs flagged if FR-4 is specified where low-loss laminate is required.
Manual review by process engineers — applies to multilayer, impedance-controlled, and high-frequency designs.
07
+
Assembly & Solderability
Engineer
Pad geometry · BGA/QFN · Wave solder direction
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SMD Pad GeometryLand patterns checked against IPC-7351 — undersized causes opens; oversized causes tombstoning.
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BGA / QFN / Fine-Pitch DevicesBall pitch, pad diameter, and SMD vs. NSMD pad definition reviewed for high-density packages.
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Through-Hole Drill-to-Lead RatioHole should be lead diameter + 0.2–0.4 mm. Too tight causes insertion failure; too loose causes poor fillet.
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Wave Solder OrientationSMD components on solder side checked for correct orientation to prevent shadowing defects.
Applies when PCBINQ is providing SMT or through-hole assembly alongside bare board fabrication.
08
+
Gerber File Completeness
Auto
Layer files · Format validity · Outline closure
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Required Layer Files PresentTop/bottom copper, drill (Excellon), solder mask, silkscreen, and board outline all verified present.
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Format & Aperture ValidityFiles parsed for valid RS-274X format, correct aperture definitions, and no corrupted data.
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Board Outline ClosureThe mechanical outline must be a fully closed polygon — open outlines prevent automated routing.
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Layer AlignmentAll layers overlaid and checked for registration — misaligned copper and mask cause systematic defects.
Quick Links
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