We have undergone rigorous vendor selection, qualification certification, and continuous evaluation. All components are under full-process quality control by experienced engineers to ensure that every chip is traceable and verifiable.
360° Visual Inspection
Microscopes help us thoroughly examine products. First, packaging gets inspected for any irregularities. Then we carefully verify the chip model and batch number.
The pin arrangement undergoes strict scrutiny to confirm three key requirements: anti-static compliance, moisture resistance, and original factory condition. This process effectively identifies refurbished or reworked components.
Solderability Testing
Our solderability testing follows J-STD-002 standards. For surface mount devices, we employ the dip-and-look method, while BGA components require ceramic plate testing.
Three scenarios demand this testing: improperly packaged items, components older than one year, and those with dirty or oxidized pins. Hot, humid environments make this testing particularly crucial.
X-Ray Inspection
X-ray technology reveals internal component details. Structural integrity gets verified first, followed by package connection analysis. Pin conditions receive special attention to detect potential issues.
The inspection catches mixed components and specification mismatches while identifying critical faults like short circuits or open connections.
Functional/Programming Testing
Testing begins with a thorough datasheet review. Our engineers then develop customized test projects and construct specialized test boards. Our advanced equipment works with over 47,000 models from 208 brands. It supports packages from DIP to QFN. It checks everything from EPROMs to MCUs.
Certification
FAQ
We provide good after-sales service. If there is a problem with the quality, you can contact us at any time